High-speed communication board:

Interface: The number of optical components is large, and the solder joints are more than 11,000 module ports, Gigabit Ethernet, DDR3x10, PCI-E and other communication interfaces.

Type: module power supply 2, buck power supply 8, VCC NET CLASS 42, maximum single-line load 15A

Difficulty: 8-layer board, high wiring density, dense high-speed signals, various types of power supplies, and increased difficulty in power plane distribution.

The number of components is large, with more than 11,000 solder joints.